HDI (high density interconnect) is used for layer count reduction, military, and aerospace products. TerraGreen is also a good laminate for these systems. Halogen-free laminates are needed in applications like transportation, mobile products, and wireless devices. RF & microwave requires laminates like IS680 TerraGreen (RF/MW) or Rogers. High thermal reliability applications like automotive, aerospace, and military may require a laminate like P95/P25 (with high Tg/Td). High speed digital boards for typical applications like servers, routers, high speed data channels (e.g., PCIe, 10 Gbe, etc.) may require a laminate like FR408HR, I-speed, etc. The choice of core and prepreg laminates depends on the type of application. For example: The first step a PCB layout engineer should do is to select the appropriate PCB laminate materials (resin, copper foil, and glass weave style) for his/her application. Understanding a PCB Laminate Material Datasheet

Some suggestions and a brief guide for designing a PCB stackup in Altium Designer.

How to estimate the number of required signal layers.

Understand datasheets for PCB laminate materials.

We will consider some design optimization to minimize the SI issues in high speed digital designs.

In this article, we will learn how to plan a PCB stackup and then how to implement it in Altium Designer.

In this article we’ll talk about some of the considerations we should have in order to create a PCB stackup correctly as this relates to the other areas of board design mentioned above. Therefore, the PCB Layout engineer needs a good understanding of EMC, PDN, EMI, and SI in order to route a modern PCB with confidence. Board density is always being pushed to the limits, EMC/EMI regulations evolved and got stricter, and edge rates have become smaller. In the last 20+ years, electronics have become increasingly more complex.

Altium designer pcb layer